page 1 formosa ms 1 2 2 2 2 3 4 4 4 5 6 6 7 list list................................................................................................. package outline............................................................................... features.......................................................................................... maximum ratings ............................................................................. rating and characteristic curves........................................................ pinning information........................................................................... marking........................................................................................... suggested solder pad layout............................................................. packing information.......................................................................... reel packing.................................................................................... suggested thermal profiles for soldering processes............................. high reliability test capabilities........................................................... mechanical data............................................................................... HFM101-S thru hfm107-s http://www.formosams.com/ tel:886-2-22696661 fax:886-2-22696141 document id issued date revised date revision page. ds-121313 2009/02/10 2010/11/10 c 7 chip high effciency rectifiers
1.0a surface mount high effciency rectifiers-50-1000v package outline page 2 formosa ms parameter conditions forward rectified current forward surge current reverse current diode junction capacitance storage temperature see fig.2 8.3ms single half sine-wave (jedec methode) f=1mhz and applied 4v dc reverse voltage symbol min. typ. max. unit i o i fsm i r c j t stg a a ua o c pf 1.0 30 5.0 +175 -65 v = v t = 25 c r rrm j o v = v t = 125 c r rrm j o 20 150 HFM101-S hfm102-s hfm103-s 50 100 200 35 70 140 symbols v rrm (v) v rms v r (v) (v) *1 *2 *3 v f (v) *4 hfm104-s hfm105-s 400 600 280 420 1.30 -55 to +150 hfm106-s hfm107-s 800 1000 560 700 trr (ns) *5 50 75 50 100 200 400 600 800 1000 1.00 1.70 (c) o operating temperature t, j http://www.formosams.com/ tel:886-2-22696661 fax:886-2-22696141 batch process design, excellent power dissipation offers better reverse leakage current and thermal resistance. low profile surface mounted application in order to optimize board space. high current capability. high surge current capability. glass passivated chip junction. features ? ultrafast recovery time for high efficiency. lead-free parts meet rohs requirments. ? suffix "-h" indicates halogen free parts, ex. HFM101-S-h. ? ? ? ? ? ? HFM101-S thru hfm107-s document id issued date revised date revision page. mechanical data epoxy:ul94-v0 rated flame retardant case : molded plastic, terminals : solder plated, solderable per mil-std-750, method 2026 polarity : indicated by cathode band mounting position : any weight : 0.05 gram ? ? ? ? ? ? do-214ac / sma-s approximated 0.213(5.4) 0.197(5.0) 0.012(0.3) typ. 0.106(2.7) 0.091(2.3) 0.071(1.8) 0.060(1.5) 0.040 (1.0) typ. 0.040(1.0) typ. 0.055(1.4) 0.063(1.6) dimensions in inches and (millimeters) sma-s *1 repetitive peak reverse voltage *2 rms voltage *3 continuous reverse voltage *4 maximum forward voltage@i =1.0a f *5 maximum reverse recovery time, note 1 note 1. reverse recovery time test condition, i =0.5a, i =1.0a, i =0.25a frrr ds-121313 2009/02/10 2010/11/10 c 7 maximum ratings and electrical characteristics (at t =25 a o c unless otherwise noted) chip high effciency rectifiers
page 3 .4 .6 .8 1.0 1.2 1.4 .001 .01 .1 1.0 10 rating and characteristic curves (HFM101-S thru hfm107-s) fig.1-typical forward characteristics fig.5-typical junction capacitance instantaneous for ward current ,(a) forward voltage,(v) pulse width 300us 1% duty cycle (+) (+) 25vdc (approx.) ( ) ( ) pulse generator (note 2) oscilliscope (note 1) 1 non- inductive notes: 1. rise time= 7ns max., input impedance= 1 megohm.22pf. 2. rise time= 10ns max., source impedance= 50 ohms. +0.5a 0 -0.25a -1.0a | | | | | | | | 1cm set time base for 50 / 10ns / cm trr d.u.t. fig.3- test circuit diagram and reverse recovery time characteristics 10 noninductive 50 noninductive t =25 c j fig.2-typical forward current average for ward current ,(a) 0.2 0.4 0.6 0.8 1.0 1.2 derating curve lead temperature ( c) 1.6 1.8 hfm105-s~hfm107-s hfm104-s HFM101-S~hfm103-s reverse voltage,(v) junction cap acitance,(pf) 140 120 100 80 60 40 20 0 .01 .05 .1 .5 1 5 10 50 100 0 25 50 75 100 125 150 175 0 fig.4-maximum non-repetitive forward surge current http://www.formosams.com/ tel:886-2-22696661 fax:886-2-22696141 document id issued date revised date revision page. ds-121313 2009/02/10 2010/11/10 c 7 peak for waard surge current ,(a) number of cycles at 60hz 10 0 20 30 40 50 110 5 50 100 t =25 c j 8.3ms single half sine wave jedec method p.c.b. mounted on 0.2 x 0.2 (5 mm x 5 mm) copper pad areas ""
formosa ms pinning information 1 2 pin1 cathode pin2 anode pin simplified outline symbol marking type number marking code HFM101-S h11 hfm102-s h12 hfm103-s h13 hfm104-s h14 hfm105-s h15 hfm106-s h16 hfm107-s h17 suggested solder pad layout page 4 http://www.formosams.com/ tel:886-2-22696661 fax:886-2-22696141 2 1 dimensions in inches and (millimeters) a c b b 0.059 (1.50) a 0.063 (1.60) c 0.110 (2.80) package sma-s HFM101-S thru hfm107-s document id issued date revised date revision page. ds-121313 2009/02/10 2010/11/10 c 7 chip high effciency rectifiers
packing information p 0 p 1 e b d f w p a d d 1 d 2 w 1 c t page 5 formosa ms http://www.formosams.com/ tel:886-2-22696661 fax:886-2-22696141 item tolerance sma-s carrier width carrier length carrier depth sprocket hole 13" reel outside diameter 7" reel outside diameter 13" reel inner diameter 7" reel inner diameter feed hole diameter sprocket hole position punch hole position punch hole pitch sprocket hole pitch embossment center reel width overall tape thickness tape width p 0 p 1 e b c d f t w p a d d d 1 d 1 d 2 w 1 symbol 0.1 0.1 0.1 min min 0.5 0.1 0.3 1.0 0.1 0.1 0.1 0.1 0.1 0.1 2.0 2.0 unit:mm 1.50 330.00 178.00 50.00 62.00 13.00 1.75 5.50 4.00 4.00 2.00 0.23 12.00 18.00 note:devices are packed in accor dance with eia standar rs-481-a and specifications listed above. 2.90 5.50 2.10 HFM101-S thru hfm107-s document id issued date revised date revision page. ds-121313 2009/02/10 2010/11/10 c 7 chip high effciency rectifiers
page 6 formosa ms http://www.formosams.com/ tel:886-2-22696661 fax:886-2-22696141 HFM101-S thru hfm107-s document id issued date revised date revision page. profile feature soldering condition average ramp-up rate(t to t ) <3 /sec preheat -temperature min(tsmin) 150 -temperature max(tsmax) 200 -time(min to max)(t ) 60~120sec tsmax to t -ramp-uprate <3 /sec time maintained above: -temperature(t ) 217 -time(t ) 60~260sec peak temperature(t ) 255 0/ 5 time within 5 of actual peak temperature(t ) ramp-down rate <6 /sec time 25 to peak temperature <6minutes lp s l l l p p o o o o o oo o o o c c c c c c- + c c c c 3.reflow soldering 10~30sec 1.storage environment: temperature=5 ~40 humidity=55%25% 2.reflow soldering of surface-mount devices oo cc suggested thermal profiles for soldering processes critical zone tl to tp critical zone tl to tp tl tsmax tsmin ramp-up tp ts preheat t25 c to peak o time 25 tl tp ramp-down temperature ds-121313 2009/02/10 2010/11/10 c 7 reel packing sma-s 2,000 4.0 20,000 183*155*183 178 382*356*392 160,000 15.5 package reel size reel component spacing box inner box reel dia, carton size carton approx. gross weight (kg) (pcs) (m/m) (m/m) (m/m) (pcs) (m/m) (pcs) 7" 13" 7,500 4.0 15,000 337*337*37 330 350*330*360 120,000 14.2 chip high effciency rectifiers
page 7 formosa ms http://www.formosams.com/ tel:886-2-22696661 fax:886-2-22696141 HFM101-S thru hfm107-s document id issued date revised date revision page. ds-121313 2009/02/10 2010/11/10 c 7 chip high effciency rectifiers 1. solder resistance 2. solderability 3. high temperature reverse bias 4. forward operation life 5. intermittent operation life 6. pressure cooker 7. temperature cycling 8. forward surge 9. humidity 10. high temperature storage life at 260 5 for 10 2sec. immerse body into solder 1/16" 1/32" at 245 5 for 5 sec. v =80% rate at t =150 for 168 hrs. rated average rectifier current at t =25 for 500hrs. t = 25 c, i = i on state: power on for 5 min. off state: power off for 5 min. on and off for 500 cycles. 15p at t =121 for 4 hrs. -55 to +125 dwelled for 30 min. and transferred for 5min. total 10 cycles. 8.3ms single half sine-wave , one surge. at t =85 , rh=85% for 1000hrs. at 175 for 1000 hrs. c c c c c cc c c o o o o o oo o o rj a afo sig a a o mil-std-750d method-2031 mil-std-202f method-208 mil-std-750d method-1038 mil-std-750d method-1027 mil-std-750d method-1036 mil-std-750d method-1051 mil-std-750d method-4066-2 mil-std-750d method-1021 mil-std-750d method-1031 jesd22-a102 item test conditions reference high reliability test capabilities
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